interconnects

英 [ˌɪntəkəˈnekts]

美 [ˌɪntərkəˈnekts]

v.  (使类似的事物)相联系，相互联系，相互连接
interconnect的第三人称单数

柯林斯词典

• V-RECIP-ERG (使)相互连接;(使)互相联系
  Things thatinterconnectorare interconnectedare connected to or with each other. You can also say that one thinginterconnects withanother.
  1. The causes are many and may interconnect...
     原因有很多而且可能互相关联。
  2. Their lives interconnect with those of celebrated figures of the late eighteenth-century...
     他们的生活与18世纪晚期的名人联系在一起。
  3. The regions are interconnected by an excellent highway system.
     那些地区通过完善的公路系统相互连接。
  4. ...a huge mesh of interconnecting wires.
     铁丝绞缠的巨网
  5. ...a dense network of nerve fibres that interconnects neurons in the brain.
     使大脑内部神经元相互连接的密集的神经纤维网络

双语例句

• Now we have five or six people that are responsible for20 interconnects on one device.
  现在我们有五，六人负责一台设备上的20个互联。
• It interconnects your use cases by providing a common vocabulary of terms with precise meanings for your use case descriptions.
  它通过为你的用例描述提供具有精确含义的通用词汇术语，来连接你的各个用例。
• Research Progress on Silicon Based Passive Photonic Integrated Devices Oriented for Application of On-chip Optical Interconnects
  面向硅基光互连应用的无源光子集成器件研究进展
• Research on Two Dimensional Near Hexagonal Close-Packed Optical Fiber Array Coupling for Parallel Optical Interconnects;
  二维准六角密排光纤阵列并行光互连耦合研究精确的六角形是最密实的钢丝束。
• Study on compression algorithm for testing crosstalk of high-speed interconnects
  高速互连系统的串扰激励测试压缩算法研究
• A fast simulation technique in time domain with part Gauss elimination ( PGE) algorithm of nonlinear high-speed VLSIC network with interconnects was presented.
  提出了一种时域内含互连线的高速非线性大规模集成电路网络的快速部分高斯消元仿真方法。
• A new method was proposed for the analysis of crosstalk of non-uniform RLC interconnects with stochastic process variations, and a stochastic perturbation model was proposed.
  提出一种基于工艺随机扰动的非均匀RLC互连线串扰分析方法；同时建立了互连线随机扰动模型。
• The characteristic model of interconnects in VLSI is proposed.
  本文提出了大规模集成电路中互连线的特征模型。
• COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
  COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
• Comprehensive electrothermal analysis of multilevel interconnects during electrostatic discharge ( ESD) pulses is carried out using the proposed nonlinear time-domain finite element method ( NTD-FEM).
  之后，本论文利用该方法对超大规模集成电路中多层高密度互连结构在静电脉冲（ESD）作用下的瞬态热响应作了系统的研究。